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NXP Semiconductors
PESD5V0L1BSF
Bidirectional low capacitance ESD protection diode
9. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
9000
PESD5V0L1BSF
SOD962
2 mm pitch, 8 mm tape and reel
-315
10. Soldering
[1]
For further information and the availability of packing methods, see Section 13 .
Footprint information for reflow soldering of leadless ultra small package; 2 terminals
0.85
0.4
R0.025 (8 × )
SOD962
0.4
0.22
(2 × )
0.12
(2 × )
0.2
(2 × )
solder land
solder paste deposit
solder land plus solder paste
solder resist
Dimensions in mm
sod962_fr
Reflow soldering is the required soldering method.
Fig 12. Required reflow soldering footprint PESD5V0L1BSF (SOD962)
Based on results of board mount testing, NXP Semiconductors requires the following
soldering guidelines:
1. Soldering footprint as indicated in Figure 12 : solder paste has to cover the whole
solder land area.
2. Non-solder mask defined (copper-defined) solder lands.
3. Minimum stencil thickness of 100 μ m.
4. Paste type 4 or smaller sphere size.
5. Pick and placement accuracy of ± 50 μ m.
PESD5V0L1BSF
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 February 2011
? NXP B.V. 2011. All rights reserved.
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